发明授权
- 专利标题： Method and apparatus for chip cooling
- 专利标题（中）： 芯片冷却方法和装置
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申请号： US12128290申请日： 2008-05-28
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公开(公告)号： US08944151B2公开(公告)日： 2015-02-03
- 发明人: Matteo Flotta , Yves C. Martin , Lubomyr T. Romankiw , Theodore G. Van Kessel
- 申请人： Matteo Flotta , Yves C. Martin , Lubomyr T. Romankiw , Theodore G. Van Kessel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Louis Percello
- 主分类号： F28D15/00
- IPC分类号： F28D15/00 ; H01L23/473
摘要：
In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.
公开/授权文献
- US20090294106A1 METHOD AND APPARATUS FOR CHIP COOLING 公开/授权日：2009-12-03
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