Invention Grant
- Patent Title: Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
- Patent Title (中): 导热塑料组合物，挤出装置和制造导热塑料的方法
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Application No.: US13829225Application Date: 2013-03-14
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Publication No.: US08946333B2Publication Date: 2015-02-03
- Inventor: Chandrashekar Raman , Bei Xiang , Anand Murugaiah
- Applicant: Momentive Performance Materials Inc.
- Applicant Address: US NY Waterford
- Assignee: Momentive Performance Materials Inc.
- Current Assignee: Momentive Performance Materials Inc.
- Current Assignee Address: US NY Waterford
- Agency: McDonald Hopkins LLC
- Agent Joseph E. Waters, Esq.
- Main IPC: C08K3/38
- IPC: C08K3/38 ; C08K3/20 ; B32B19/04 ; C08K5/5425 ; C08K5/54 ; C08K3/22 ; C08K13/02 ; B29C47/64 ; C08J3/20 ; B29B7/42 ; B29B7/48 ; B29C47/38 ; B29C47/60 ; B29C47/00 ; B29B7/84 ; B29B7/90
Abstract:
A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
Public/Granted literature
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