- 专利标题： Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor
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申请号： US13698279申请日： 2011-05-18
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公开(公告)号： US08946357B2公开(公告)日： 2015-02-03
- 发明人: Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- 申请人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- 申请人地址： JP Tokyo
- 专利权人： JNC Corporation
- 当前专利权人： JNC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Jianq Chyun IP Office
- 优先权： JP2010-114049 20100518
- 国际申请： PCT/JP2011/061359 WO 20110518
- 国际公布： WO2011/145638 WO 20111124
- 主分类号： C08F30/08
- IPC分类号： C08F30/08 ; C09D183/04 ; C07F7/21 ; C08G77/04 ; H01L23/29 ; C09K3/10 ; C08G77/20 ; C08G77/00 ; H01L33/56
摘要：
A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0≦a≦3.5, 0≦b≦3.5, and 0≦c≦1 are obtained, and also a+b+2c=4 is obtained:
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