- Patent Title: Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor
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Application No.: US13698279Application Date: 2011-05-18
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Publication No.: US08946357B2Publication Date: 2015-02-03
- Inventor: Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- Applicant: Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
- Applicant Address: JP Tokyo
- Assignee: JNC Corporation
- Current Assignee: JNC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2010-114049 20100518
- International Application: PCT/JP2011/061359 WO 20110518
- International Announcement: WO2011/145638 WO 20111124
- Main IPC: C08F30/08
- IPC: C08F30/08 ; C09D183/04 ; C07F7/21 ; C08G77/04 ; H01L23/29 ; C09K3/10 ; C08G77/20 ; C08G77/00 ; H01L33/56
Abstract:
A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0≦a≦3.5, 0≦b≦3.5, and 0≦c≦1 are obtained, and also a+b+2c=4 is obtained:
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