发明授权
- 专利标题： Method for electrochemically depositing carbon film on a substrate
- 专利标题（中）： 在基板上电化学沉积碳膜的方法
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申请号： US12789848申请日： 2010-05-28
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公开(公告)号： US08951401B2公开(公告)日： 2015-02-10
- 发明人: Tokujiro Nishikiori , Hiroaki Amahashi , Kouji Kuroda , Yasuhiko Ito , Naohiro Yasuda
- 申请人： Tokujiro Nishikiori , Hiroaki Amahashi , Kouji Kuroda , Yasuhiko Ito , Naohiro Yasuda
- 申请人地址： JP Aichi JP Kyoto JP Hogyo JP Kyoto
- 专利权人： Toyota Boshoku Kabushiki Kaisha,I'msep Co., Ltd.,Sec Carbon, Limited,The Doshisha
- 当前专利权人： Toyota Boshoku Kabushiki Kaisha,I'msep Co., Ltd.,Sec Carbon, Limited,The Doshisha
- 当前专利权人地址： JP Aichi JP Kyoto JP Hogyo JP Kyoto
- 代理机构： Greenblum & Bernstein, P.L.C.
- 主分类号： C25D3/66
- IPC分类号： C25D3/66 ; C25D9/04
摘要：
Dense carbon films are deposited on a conductive substrate by placing the substrate acting as anode in a molten salt electrolyte bath containing a source of carbide ion and applying DC current across the substrate and a counter electrode acting as cathode also placed in the molten salt electrolyte bath. The carbide ions are electrochemically oxidized to deposit a carbon film on the surface of the substrate.