Invention Grant
- Patent Title: Method for electrochemically depositing carbon film on a substrate
- Patent Title (中): 在基板上电化学沉积碳膜的方法
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Application No.: US12789848Application Date: 2010-05-28
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Publication No.: US08951401B2Publication Date: 2015-02-10
- Inventor: Tokujiro Nishikiori , Hiroaki Amahashi , Kouji Kuroda , Yasuhiko Ito , Naohiro Yasuda
- Applicant: Tokujiro Nishikiori , Hiroaki Amahashi , Kouji Kuroda , Yasuhiko Ito , Naohiro Yasuda
- Applicant Address: JP Aichi JP Kyoto JP Hogyo JP Kyoto
- Assignee: Toyota Boshoku Kabushiki Kaisha,I'msep Co., Ltd.,Sec Carbon, Limited,The Doshisha
- Current Assignee: Toyota Boshoku Kabushiki Kaisha,I'msep Co., Ltd.,Sec Carbon, Limited,The Doshisha
- Current Assignee Address: JP Aichi JP Kyoto JP Hogyo JP Kyoto
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: C25D3/66
- IPC: C25D3/66 ; C25D9/04
Abstract:
Dense carbon films are deposited on a conductive substrate by placing the substrate acting as anode in a molten salt electrolyte bath containing a source of carbide ion and applying DC current across the substrate and a counter electrode acting as cathode also placed in the molten salt electrolyte bath. The carbide ions are electrochemically oxidized to deposit a carbon film on the surface of the substrate.
Public/Granted literature
- US20110290655A1 METHOD FOR ELECTROCHEMICALLY DEPOSITING CARBON FILM ON A SUBSTRATE Public/Granted day:2011-12-01
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