Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US14214389Application Date: 2014-03-14
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Publication No.: US08951836B2Publication Date: 2015-02-10
- Inventor: Yu-Lin Yen , Chien-Hui Chen , Tsang-Yu Liu , Long-Sheng Yeou
- Applicant: Xintec Inc.
- Applicant Address: TW Jhongli
- Assignee: Xintec, Inc.
- Current Assignee: Xintec, Inc.
- Current Assignee Address: TW Jhongli
- Agency: Liu & Liu
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/768 ; B81B7/00 ; H01L23/48 ; H01L23/498 ; H01L23/00 ; H01L23/31 ; H01L25/065
Abstract:
A method for forming a chip package, in which a substrate has a plurality of conducting pads located below its lower surface, and a dielectric layer located between the conducting pads. A hole is formed extending from the upper surface of the substrate towards the conducting pads. After the hole is formed, a trench is formed extending from the upper surface towards the lower surface of the substrate, with the trench connecting with the hole. An insulating layer is formed on a sidewall of the trench and a sidewall and a bottom of the hole, and a portion of the insulating layer and a portion of the dielectric layer are removed to expose a portion of the conducting pads. A conducting layer is formed on the sidewall of the trench and the sidewall and the bottom of the hole, electrically contacting with the conducting pads.
Public/Granted literature
- US20140199835A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2014-07-17
Information query
IPC分类:
