发明授权
- 专利标题: Three-dimensional semiconductor memory devices and methods for manufacturing same
- 专利标题(中): 三维半导体存储器件及其制造方法
-
申请号: US13828557申请日: 2013-03-14
-
公开(公告)号: US08952448B2公开(公告)日: 2015-02-10
- 发明人: Junkyu Yang , Phil Ouk Nam , Youngseon Son , Kwangyoung Lee , Kihyun Hwang
- 申请人: Junkyu Yang , Phil Ouk Nam , Youngseon Son , Kwangyoung Lee , Kihyun Hwang
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, PA
- 优先权: KR10-2012-0054325 20120522
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L27/088 ; H01L27/115
摘要:
A three-dimensional (3D) nonvolatile memory device includes a vertical stack of nonvolatile memory cells on a substrate having a region of first conductivity type therein. A dopant region of second conductivity type is provided in the substrate. This dopant region forms a P-N rectifying junction with the region of first conductivity type and has a concave upper surface that is recessed relative to an upper surface of the substrate upon which the vertical stack of nonvolatile memory cells extends. An electrically insulating electrode separating pattern is provided, which extends through the vertical stack of nonvolatile memory cells and into the recess in the dopant region of second conductivity type.
公开/授权文献
信息查询
IPC分类: