发明授权
- 专利标题： Scribe lines in wafers
- 专利标题（中）： 抄写线在晶圆
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申请号： US13619705申请日： 2012-09-14
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公开(公告)号： US08952497B2公开(公告)日： 2015-02-10
- 发明人: U-Ting Chen , Dun-Nian Yaung , Jen-Cheng Liu , Feng-Chi Hung , Jeng-Shyan Lin , Shuang-Ji Tsai
- 申请人： U-Ting Chen , Dun-Nian Yaung , Jen-Cheng Liu , Feng-Chi Hung , Jeng-Shyan Lin , Shuang-Ji Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L23/00
摘要：
A wafer includes a plurality of chips arranged as rows and columns. A first plurality of scribe lines is between the rows of the plurality of chips. Each of the first plurality of scribe lines includes a metal-feature containing scribe line comprising metal features therein, and a metal-feature free scribe line parallel to, and adjoining, the metal-feature containing scribe line. A second plurality of scribe lines is between the columns of the plurality of chips.
公开/授权文献
- US20140077320A1 Scribe Lines in Wafers 公开/授权日：2014-03-20
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