Invention Grant
- Patent Title: Wiring board and method for manufacturing wiring board
- Patent Title (中): 接线板及制造接线板的方法
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Application No.: US13963246Application Date: 2013-08-09
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Publication No.: US08952507B2Publication Date: 2015-02-10
- Inventor: Toyotaka Shimabe , Keisuke Shimizu , Toshiki Furutani
- Applicant: Ibiden Co., Ltd.
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-178953 20120810
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/18 ; H01L23/495 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56
Abstract:
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.
Public/Granted literature
- US20140042602A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD Public/Granted day:2014-02-13
Information query
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