公开(公告)号：US20240339698A1

公开(公告)日：2024-10-10

申请号：US18293275

申请日：2022-02-25

申请人： IBIDEN CO., LTD.

发明人： Shohei SHIMADA ,  Masataka YAMAGUCHI ,  Naoyuki JIMBO

IPC分类号： H01M10/658 ,  F16L59/02 ,  H01M50/204 ,  H01M50/293

CPC分类号： H01M10/658 ,  F16L59/026 ,  F16L59/029 ,  H01M50/204 ,  H01M50/293

摘要： A thermal insulation sheet containing a thermal insulation material containing inorganic particles and a resin film covering at least a part of a surface of the thermal insulation material. A method for producing the thermal insulation sheet, including: molding a material for a thermal insulation material containing the inorganic particles into a sheet shape; and coating the surface of the thermal insulation material molded into the sheet shape with the resin film forming composition by a screen printing method or a spray coat printing method to form the resin film.

公开(公告)号：US20240237231A9

公开(公告)日：2024-07-11

申请号：US18489884

申请日：2023-10-19

申请人： IBIDEN CO., LTD.

发明人： Ikuya TERAUCHI

IPC分类号： H05K3/40 ,  H05K3/00

CPC分类号： H05K3/4038 ,  H05K3/0055 ,  H05K3/4007 ,  H05K2203/107

摘要： A method for manufacturing a wiring substrate includes forming first conductor pads and second conductor pads having a shorter inter-pad distance than the first conductor pads, forming a second insulating layer covering the first conductor pads and the second conductor pads, forming first via holes exposing the first conductor pads, applying a first desmear treatment such that residues are removed from the first via holes, forming second via holes in the second insulating layer after the first desmear treatment such that the second via holes expose the second conductor pads, applying a second desmear treatment such that residues are removed from the second via holes, forming first via conductors in the first via holes such that the first via conductors are formed on the first conductor pads, and forming second via conductors in the second via holes such that the second via conductor are formed on the second conductor pads.

公开(公告)号：US20240237204A1

公开(公告)日：2024-07-11

申请号：US18408629

申请日：2024-01-10

申请人： IBIDEN CO., LTD.

发明人： Keisuke SHIMIZU ,  Fumio NISHIWAKI ,  Ryoya KIMURA

IPC分类号： H05K1/02

CPC分类号： H05K1/0298 ,  H05K2201/0209 ,  H05K2201/0242

摘要： A wiring substrate includes a first wiring part including a first insulating layer and a first conductor layer laminated on the first insulating layer, and a second wiring part including a second insulating layer and a second conductor layer laminated on the second insulating layer. The thickness of the second insulating layer is smaller than that of the first insulating layer. The thickness of the second conductor layer is smaller than that of the first conductor layer. The first conductor layer includes first wirings including differential wirings having the minimum wiring width of larger than 5 μm and minimum inter-wiring distance of larger than 7 μm. The second conductor layer includes second wirings having the maximum wiring width of 5 μm or less and the maximum inter-wiring distance of 7 μm or less. The second part is positioned closer to the outermost surface of the substrate than the first part.

公开(公告)号：US20240234326A9

公开(公告)日：2024-07-11

申请号：US18489952

申请日：2023-10-19

申请人： IBIDEN CO., LTD.

发明人： Ikuya TERAUCHI ,  Shogo FUKUI ,  Ryo ANDO ,  Keisuke SHIMIZU

IPC分类号： H01L23/538 ,  H05K1/11

CPC分类号： H01L23/5383 ,  H01L23/5386 ,  H05K1/116 ,  H05K2201/0939 ,  H05K2201/094

摘要： A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first via conductors are formed on the first conductor pads, and second via conductors formed in second via holes penetrating through the second insulating layer such that the second via conductors are formed on the second conductor pads. The first and second conductor pads are formed such that an annular width amount of each second conductor pad is smaller than an annular width amount of each first conductor pad and that a haloing amount in each second conductor pad is smaller than a haloing amount in each first conductor pad.

公开(公告)号：US12034141B2

公开(公告)日：2024-07-09

申请号：US17275191

申请日：2020-08-26

申请人： IBIDEN CO., LTD.

发明人： Hisashi Ando ,  Naoki Takahashi

IPC分类号： H01M10/658 ,  F16L59/02 ,  H01M10/61 ,  H01M10/625 ,  H01M10/651 ,  H01M10/6555 ,  H01M50/204

CPC分类号： H01M10/658 ,  H01M10/651 ,  H01M10/6555

摘要： A heat-insulating sheet for a battery pack is interposed between battery cells of the battery pack in which the battery cells are connected in series or in parallel. The heat-insulating sheet for the battery pack contains a first particle made from a silica nanoparticle and a second particle made from a metal oxide. A content of the first particle is 60 mass % or more and 95 mass % or less relative to a total mass of the first particle and the second particle.

公开(公告)号：US12033927B2

公开(公告)日：2024-07-09

申请号：US17361522

申请日：2021-06-29

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49822 ,  H01L21/4857

摘要： A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

公开(公告)号：US12031471B2

公开(公告)日：2024-07-09

申请号：US18475207

申请日：2023-09-27

申请人： IBIDEN CO., LTD.

发明人： Toshiyuki Maeda ,  Takayuki Kawabe

IPC分类号： F01N3/28 ,  B01D53/88

CPC分类号： F01N3/2835 ,  B01D53/88

摘要： A mat material having a sufficiently high initial compression surface pressure is provided. The mat material of the present disclosure includes inorganic fibers; and an inorganic binder and an organic binder attached to the inorganic fibers, wherein the mat material has an initial compression surface pressure of 900 kPa or more as measured when compressed to a bulk density of 0.50 g/cm3.

公开(公告)号：US20240223038A1

公开(公告)日：2024-07-04

申请号：US18605882

申请日：2024-03-15

申请人： IBIDEN CO., LTD.

发明人： Takahisa HIRASAWA ,  Takayuki FURUNO

IPC分类号： H02K3/28 ,  H02K1/12

CPC分类号： H02K3/28 ,  H02K1/12 ,  H02K2203/03

摘要： A coil substrate includes a flexible substrate, and a coil including a first wiring formed on a first surface of the flexible substrate and a second wiring formed on a second surface of the flexible substrate on the opposite side with respect to the first surface. The flexible substrate is formed to be wound around an axis extending in an orthogonal direction orthogonal to a longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coil is formed such that the first wiring has a first orthogonal part extending along the orthogonal direction, that the second wiring has a second orthogonal part extending along the orthogonal direction, and that at least one of the first orthogonal part and the second orthogonal part has at least one slit formed along the orthogonal direction.

公开(公告)号：US20240195252A1

公开(公告)日：2024-06-13

申请号：US18581985

申请日：2024-02-20

申请人： IBIDEN CO., LTD.

发明人： Takahisa HIRASAWA ,  Takayuki FURUNO

IPC分类号： H02K3/26

CPC分类号： H02K3/26 ,  H02K2203/03

摘要： A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that each of the coils includes wirings formed on the first surface of the flexible substrate and wirings formed on the second surface of the flexible substrate. The coils include an N-th coil forming an N-th phase and an (N+1)-th coil formed adjacent to the N-th coil and forming an (N+1)-th phase different from the N-th phase, and each coil is formed such that an inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the N-th coil, and the inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the (N+1)-th coil.

公开(公告)号：US12010796B2

公开(公告)日：2024-06-11

申请号：US17752916

申请日：2022-05-25

申请人： IBIDEN CO., LTD.

发明人： Yoshinori Takenaka

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/116 ,  H05K1/0298 ,  H05K1/0373 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09827

摘要： A wiring substrate includes an insulating layer including resin and filler particles, conductor layers including an upper-layer conductor layer and a lower-layer conductor layer such that the insulating layer is sandwiched between the upper-layer and lower-layer conductor layers, and a penetrating conductor formed in the insulating layer such that the penetrating conductor is penetrating through the insulating layer and connecting the upper-layer and lower-layer conductor layers. The penetrating conductor is formed such that the penetrating conductor has a first length which is the maximum width of the penetrating conductor in the direction orthogonal to the thickness direction of the wiring substrate and the first length is 25 μm or less, and the insulating layer is formed such that the maximum particle size of the filler particles in a region within the distance of 40% of the first length from the penetrating conductor is 20% or less of the first length.