Invention Grant
- Patent Title: Semiconductor packages with integrated antenna and method of forming thereof
- Patent Title (中): 具有集成天线的半导体封装及其形成方法
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Application No.: US13736553Application Date: 2013-01-08
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Publication No.: US08952521B2Publication Date: 2015-02-10
- Inventor: Maciej Wojnowski , Walter Hartner , Ottmar Geitner , Gottfried Beer , Klaus Pressel , Mehran Pour Mousavi
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: EP12007249 20121019
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/66 ; H01L21/768 ; H01L23/498 ; H01Q1/22 ; H01Q9/04 ; H01Q9/16 ; H01Q23/00 ; H01L23/31
Abstract:
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.
Public/Granted literature
- US20140110840A1 Semiconductor Packages with Integrated Antenna and Method of Forming Thereof Public/Granted day:2014-04-24
Information query
IPC分类:
