Invention Grant
- Patent Title: Heat-dissipating module
- Patent Title (中): 散热模块
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Application No.: US13562636Application Date: 2012-07-31
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Publication No.: US08953319B2Publication Date: 2015-02-10
- Inventor: Cheng-Yu Wang
- Applicant: Cheng-Yu Wang
- Applicant Address: TW Taipei
- Assignee: Asustek Computer Inc.
- Current Assignee: Asustek Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/36 ; H01L23/40 ; H01L23/427
Abstract:
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.
Public/Granted literature
- US20130039011A1 HEAT-DISSIPATING MODULE Public/Granted day:2013-02-14
Information query
