Invention Grant
US08956945B2 Trench isolation for bipolar junction transistors in BiCMOS technology
有权
BiCMOS技术中双极结晶体管的沟槽隔离
- Patent Title: Trench isolation for bipolar junction transistors in BiCMOS technology
- Patent Title (中): BiCMOS技术中双极结晶体管的沟槽隔离
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Application No.: US13757961Application Date: 2013-02-04
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Publication No.: US08956945B2Publication Date: 2015-02-17
- Inventor: James S. Dunn , Qizhi Liu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans LLP
- Agent Anthony J. Canale
- Main IPC: H01L21/331
- IPC: H01L21/331 ; G06F17/50 ; H01L29/66 ; H01L29/737 ; H01L29/06

Abstract:
Device structures, fabrication methods, and design structures for a bipolar junction transistor. A first isolation structure is formed in a substrate to define a boundary for a device region. A collector is formed in the device region, and a second isolation structure is formed in the device region. The second isolation structure defines a boundary for the collector. The second isolation structure is laterally positioned relative to the first isolation structure to define a section of the device region between the first and second isolation structures.
Public/Granted literature
- US20140217551A1 TRENCH ISOLATION FOR BIPOLAR JUNCTION TRANSISTORS IN BICMOS TECHNOLOGY Public/Granted day:2014-08-07
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