Invention Grant
- Patent Title: Molded interposer package and method for fabricating the same
- Patent Title (中): 模制插入器封装及其制造方法
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Application No.: US13616890Application Date: 2012-09-14
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Publication No.: US08957518B2Publication Date: 2015-02-17
- Inventor: Thomas Matthew Gregorich , Andrew C. Chang , Tzu-Hung Lin
- Applicant: Thomas Matthew Gregorich , Andrew C. Chang , Tzu-Hung Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L23/495
Abstract:
The invention provides a molded interposer package and a method for fabricating the same. The molded interposer package includes a plurality of metal studs. A molding material encapsulates the metal studs leaving the bottom surfaces of the metal studs exposed. A first chip is disposed on the molding material, connecting to the top surfaces of the metal studs. A plurality of solder balls connects and contacts to the bottom surfaces of the metal studs.
Public/Granted literature
- US20130168857A1 MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2013-07-04
Information query
IPC分类:
