发明授权
- 专利标题: Pattern measurement device and pattern measurement method
- 专利标题(中): 图案测量装置和图案测量方法
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申请号: US14233003申请日: 2012-03-23
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公开(公告)号: US08959461B2公开(公告)日: 2015-02-17
- 发明人: Takuma Shibahara , Michio Oikawa , Yutaka Hojo , Hitoshi Sugahara , Hiroyuki Shindo
- 申请人: Takuma Shibahara , Michio Oikawa , Yutaka Hojo , Hitoshi Sugahara , Hiroyuki Shindo
- 申请人地址: JP Tokyo
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2011-195897 20110908
- 国际申请: PCT/JP2012/057568 WO 20120323
- 国际公布: WO2013/035364 WO 20130314
- 主分类号: G06F17/50
- IPC分类号: G06F17/50 ; H01J37/26 ; G01B15/04 ; G03F1/36 ; H01L21/66 ; G01N23/225
摘要:
A pattern measurement device includes: a storage section storing mask edge data of a circuit pattern and image data obtained by imaging the circuit pattern; an SEM contour extracting section receiving the image data, SEM contour of the circuit pattern, and cause an exposure simulator to generate estimated SEM contour data of an estimated SEM contour on the basis of the mask edge data and SEM contour data of the extracted SEM contour; a shape classifying section receiving the mask edge data, the SEM contour data, and the estimated contour data to classify the SEM contour data and the estimated SEM contour data into a one-dimensionally shaped contour and a two-dimensionally shaped contour; and an SEM contour sampling section receiving the SEM contour data and the estimated SEM contour data to sample the SEM contour data on the basis of types of the one-dimensionally and two-dimensionally shaped contours.
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