Invention Grant
- Patent Title: Circumference splice for joining shell structures
- Patent Title (中): 用于连接壳结构的圆周接头
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Application No.: US13665664Application Date: 2012-10-31
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Publication No.: US08960606B2Publication Date: 2015-02-24
- Inventor: Paul Diep , Bernhard Dopker
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Walters & Wasylyna LLC
- Main IPC: B64C1/12
- IPC: B64C1/12 ; B64C1/06

Abstract:
The disclosed shell structure splice and method may include a first panel having a first edge, a second panel having a second edge, the second edge being positioned in edgewise alignment with the first edge to form a splice joint, a strap bridging the splice joint and attached to the first panel and the second panel, the strap having a first tapered region and a second tapered region, a first fitting having a tapered section and a flat section, the tapered section being attached to the first tapered region of the strap, and a second fitting having a tapered section and a flat section, the tapered section being attached to the second tapered region of the strap.
Public/Granted literature
- US20140117157A1 Circumference Splice for Joining Shell Structures Public/Granted day:2014-05-01
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