发明授权
US08962361B2 Method for producing a semiconductor chip emitting radiation, semiconductor chip emitting radiation, and component emitting radiation
有权
用于制造发射辐射的半导体芯片，发射辐射的半导体芯片和发射辐射的部件的方法
- 专利标题： Method for producing a semiconductor chip emitting radiation, semiconductor chip emitting radiation, and component emitting radiation
- 专利标题（中）： 用于制造发射辐射的半导体芯片，发射辐射的半导体芯片和发射辐射的部件的方法
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申请号： US13991408申请日： 2011-11-23
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公开(公告)号： US08962361B2公开(公告)日： 2015-02-24
- 发明人: Kirstin Petersen , Frank Baumann , Dominik Eisert , Hailing Cui
- 申请人： Kirstin Petersen , Frank Baumann , Dominik Eisert , Hailing Cui
- 申请人地址： DE Regensburg
- 专利权人： Osram Opto Semiconductors GmbH
- 当前专利权人： Osram Opto Semiconductors GmbH
- 当前专利权人地址： DE Regensburg
- 代理机构： Slater & Matsil, L.L.P.
- 优先权： DE102010053362 20101203
- 国际申请： PCT/EP2011/070863 WO 20111123
- 国际公布： WO2012/072471 WO 20120607
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/50
摘要：
A method is provided for producing a radiation-emitting semiconductor chip, in which a first wavelength-converting layer is applied over the radiation exit face of a semiconductor body. The application method is selected from the following group: sedimentation, electrophoresis. In addition, a second wavelength-converting layer is applied over the radiation exit face of the semiconductor body. The second wavelength-converting layer is either produced in a separate method step and then applied or the application method is sedimentation, electrophoresis or printing. Furthermore, a radiation-emitting semiconductor chip and a radiation-emitting component are provided.
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