Invention Grant
- Patent Title: Method for fabricating capacitor with high aspect ratio
- Patent Title (中): 具有高纵横比的电容器制造方法
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Application No.: US13494400Application Date: 2012-06-12
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Publication No.: US08962437B2Publication Date: 2015-02-24
- Inventor: Beom-Yong Kim , Kee-Jeung Lee , Yun-Hyuck Ji , Seung-Mi Lee , Jae-Hyoung Koo , Kwan-Woo Do , Kyung-Woong Park , Ji-Hoon Ahn , Woo-Young Park
- Applicant: Beom-Yong Kim , Kee-Jeung Lee , Yun-Hyuck Ji , Seung-Mi Lee , Jae-Hyoung Koo , Kwan-Woo Do , Kyung-Woong Park , Ji-Hoon Ahn , Woo-Young Park
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2012-0027823 20120319
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A method for fabricating a capacitor includes: forming a first silicon layer over a semiconductor substrate, where the first silicon layer is doped with a dopant; forming an undoped second silicon layer over the first silicon layer; forming an opening by etching the second silicon layer and the first silicon layer; forming a storage node in the opening; and removing the first silicon layer and the second silicon layer.
Public/Granted literature
- US20130244394A1 METHOD FOR FABRICATING CAPACITOR WITH HIGH ASPECT RATIO Public/Granted day:2013-09-19
Information query
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