Invention Grant
- Patent Title: Semiconductor device and method for forming the same
- Patent Title (中): 半导体装置及其形成方法
-
Application No.: US13618127Application Date: 2012-09-14
-
Publication No.: US08963252B2Publication Date: 2015-02-24
- Inventor: Moojin Kim , Jeongyun Lee
- Applicant: Moojin Kim , Jeongyun Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0115012 20111107
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L27/02

Abstract:
Semiconductor devices and methods of forming the same are provided. The semiconductor device may include a semiconductor element disposed on a substrate and including an insulating layer and a gate electrode, a doped region having a first conductivity-type on the substrate, a conductive interconnection electrically connected to the gate electrode, and a first contact plug having a second conductivity-type and electrically connecting the conductive interconnection and the doped region to each other and constituting a Zener diode by junction with the doped region.
Public/Granted literature
- US20130113046A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-05-09
Information query
IPC分类: