Invention Grant
- Patent Title: Printed circuit board radio-frequency shielding structures
- Patent Title (中): 印刷电路板射频屏蔽结构
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Application No.: US13632908Application Date: 2012-10-01
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Publication No.: US08969737B2Publication Date: 2015-03-03
- Inventor: Andrew B. Just , Trent Weber , Shigefumi Honjo
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz; Kendall P. Woodruff
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/14 ; H05K1/18

Abstract:
Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.
Public/Granted literature
- US20130027897A1 PRINTED CIRCUIT BOARD RADIO-FREQUENCY SHIELDING STRUCTURES Public/Granted day:2013-01-31
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