发明授权
- 专利标题： Semiconductor chip package and method
- 专利标题（中）： 半导体芯片封装及方法
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申请号： US13221607申请日： 2011-08-30
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公开(公告)号： US08969985B2公开(公告)日： 2015-03-03
- 发明人: Volker Strutz , Stefan Landau , Udo Ausserlechner
- 申请人： Volker Strutz , Stefan Landau , Udo Ausserlechner
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L27/22
- IPC分类号： H01L27/22 ; H01L23/04 ; H01L23/48 ; H01L25/16 ; H01L43/04 ; G01R33/07 ; G01R33/00 ; H01L23/00 ; H01L23/31
摘要：
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.
公开/授权文献
- US20130049746A1 Semiconductor Chip Package and Method 公开/授权日：2013-02-28
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