Invention Grant
US08975101B2 Element connecting board, producing method thereof, and light emitting diode device
有权
元件连接板及其制造方法以及发光二极管装置
- Patent Title: Element connecting board, producing method thereof, and light emitting diode device
- Patent Title (中): 元件连接板及其制造方法以及发光二极管装置
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Application No.: US14315948Application Date: 2014-06-26
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Publication No.: US08975101B2Publication Date: 2015-03-10
- Inventor: Yasunari Ooyabu , Kazuhiro Fuke , Daisuke Tsukahara , Takashi Kondo
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-261702 20111130
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/52 ; F21V21/00 ; H01L33/46 ; H05K13/00 ; H01L33/62 ; H01L25/075
Abstract:
An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces.
Public/Granted literature
- US20140329346A1 ELEMENT CONNECTING BOARD, PRODUCING METHOD THEREOF, AND LIGHT EMITTING DIODE DEVICE Public/Granted day:2014-11-06
Information query
IPC分类:
