公开(公告)号：US20210249780A1

公开(公告)日：2021-08-12

申请号：US17264095

申请日：2020-06-05

Applicant: NITTO DENKO CORPORATION

Inventor： Takehiro Ui ,  Masatsugu Koso ,  Kazuhiro Fuke ,  Yuya Matsuzaki ,  Masataka Usui

IPC: H01Q17/00

Abstract: A radio wave absorbing member 1a includes a radio wave absorber 10 and a support 20 having a sheet shape. The radio wave absorber 10 includes a resistive layer 12, a reflective layer 14, and a dielectric layer 13. The reflective layer 14 reflects a radio wave. The dielectric layer 13 is disposed between the resistive layer 12 and the reflective layer 14 in the thickness direction of the reflective layer 14. The support 20 supports the radio wave absorber 10. The support 20 includes a matrix resin 20m and a flame retardant 20p.

公开(公告)号：US11654655B2

公开(公告)日：2023-05-23

申请号：US16649827

申请日：2018-09-28

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuhiro Fuke ,  Masatsugu Koso

IPC: B32B15/14 ,  B32B5/02 ,  B32B5/26 ,  B32B7/12 ,  B32B27/20 ,  B32B27/38 ,  B32B5/12 ,  B32B15/092

CPC classification number: B32B15/14 ,  B32B5/02 ,  B32B5/022 ,  B32B5/12 ,  B32B5/26 ,  B32B7/12 ,  B32B15/092 ,  B32B27/20 ,  B32B27/38 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/102

Abstract: A reinforcement sheet for reinforcing a metal plate by adhering to the metal plate includes a core material layer containing a resin and a front layer disposed at one side in a thickness direction of the core material layer. The front layer is obtained by laminating a plurality of unidirectional liber resin composite sheets, and an area ratio of a void in a cross section of a solidified material of the core material layer is 50% or less.

公开(公告)号：US09287473B2

公开(公告)日：2016-03-15

申请号：US14559108

申请日：2014-12-03

Applicant: NITTO DENKO CORPORATION

Inventor： Hidenori Onishi ,  Shinya Ota ,  Kazuhiro Fuke

IPC: H01L33/60 ,  H01L33/56 ,  C08L63/00 ,  C08G59/20 ,  C08G59/42 ,  C08K5/06 ,  C08K3/22 ,  C08K3/36 ,  H01L33/62 ,  C08L63/06

CPC classification number: H01L33/56 ,  C08G59/42 ,  C08K5/06 ,  C08K2003/2241 ,  C08L63/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L71/02

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

公开(公告)号：US09029894B2

公开(公告)日：2015-05-12

申请号：US13874613

申请日：2013-05-01

Applicant: Nitto Denko Corporation

Inventor： Kazuhiro Fuke

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L23/495 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L23/495 ,  H01L24/97 ,  H01L33/48 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a lead frame for an optical semiconductor device including: a lead frame having a first plate part and a second plate part disposed so as to oppose to the first plate part; an optical semiconductor element placed in the second plate part and electrically connected to the second plate part; a wire for electrically connecting the optical semiconductor element and the first plate part to each other; a circumferential reflector formed on the lead frame so as to surround a circumference of the optical semiconductor element; and a transparent resin for encapsulating the optical semiconductor element, filled in a recess formed by the lead frame and an inner periphery of the reflector, in which the lead frame has a contour shape substantially the same as a bottom contour shape of the inner periphery of the reflector for forming the recess.

Abstract translation: 本发明涉及一种用于光学半导体器件的引线框架，包括：引线框架，具有第一板部分和与第一板部分相对设置的第二板部分; 光学半导体元件，其放置在所述第二板部中并电连接到所述第二板部; 用于将光半导体元件和第一板部彼此电连接的线; 形成在所述引线框架上以围绕所述光学半导体元件的圆周的周向反射器; 以及用于封装光学半导体元件的透明树脂，填充在由引线框架形成的凹部和反射器的内周中，其中引线框架具有与内周的底部轮廓形状基本相同的轮廓形状 用于形成凹部的反射器。

公开(公告)号：US20230077842A1

公开(公告)日：2023-03-16

申请号：US17796938

申请日：2021-01-14

Applicant: NITTO DENKO CORPORATION

Inventor： Yuya Matsuzaki ,  Kazuhiro Fuke ,  Takehiro Ui

IPC: H05K9/00

Abstract: A composite material and an electromagnetic wave absorber made by molding the same, which are capable of exhibiting an excellent electromagnetic wave absorption function and capable of suppressing the deterioration of mechanical properties of the electromagnetic wave absorber itself. A composite material comprising a single type of thermoplastic resin and a conductive filler contained in a dispersed state in the thermoplastic resin, wherein the composite material includes at least one portion A and a portion B with different conductive filler content percentages in a mixed manner, and wherein the ratio of the conductive filler content percentage in the portion A to the conductive filler content percentage in the portion B is greater than 1.0; and an electromagnetic wave absorber made by molding the same.

公开(公告)号：US20160111611A1

公开(公告)日：2016-04-21

申请号：US14893651

申请日：2014-05-27

Applicant: NITTO DENKO CORPORATION

Inventor： Naoko Yoshida ,  Kazuhiro Fuke ,  Hidenori Onishi ,  Ryusuke Naito ,  Yuichi Fukamichi

IPC: H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/56 ,  C08K3/013 ,  C08K3/22 ,  C08K5/09 ,  C08K2003/2244 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  C08L63/00 ,  C08K3/0033

Abstract: An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.

Abstract translation: 一种光学半导体器件包括：金属引线框架，包括第一和第二板部分;安装在金属引线框架上的光学半导体元件;以及设置在光学半导体元件周围的反射器。 反射体的材料是环氧树脂组合物，其含有：（A）环氧树脂; （B）固化剂; （C）白色颜料; （D）无机填料; 和（E）羧酸和水中的至少一种。 组分（C）和（D）以总环氧树脂组合物的总量为基准计，总重量为69-94重量％，组分（E）的比例为4-23摩尔％ 组分（B）和（E）的总量。 该树脂组合物具有较高的玻璃化转变温度，并且成型性和抗粘连性优异且基本上没有翘曲。

公开(公告)号：US08975101B2

公开(公告)日：2015-03-10

申请号：US14315948

申请日：2014-06-26

Applicant: Nitto Denko Corporation

Inventor： Yasunari Ooyabu ,  Kazuhiro Fuke ,  Daisuke Tsukahara ,  Takashi Kondo

IPC: H01L21/00 ,  H01L33/52 ,  F21V21/00 ,  H01L33/46 ,  H05K13/00 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/52 ,  F21V21/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K13/00 ,  Y10T29/49124 ,  H01L2924/00014

Abstract: An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces.

Abstract translation: 元件连接板是用于允许发光二极管元件在厚度方向上与其一侧连接的引线框架。 元件连接板包括引线框架，引线框架设置有彼此间隔开的多个引线，以及第一绝缘树脂部分，其是光反射并填充空间的。

公开(公告)号：US11964439B2

公开(公告)日：2024-04-23

申请号：US16765644

申请日：2018-10-31

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuhiro Fuke ,  Masatsugu Koso

IPC: B29C65/00 ,  B29C65/50 ,  B32B7/12 ,  B32B17/10 ,  B29C33/38 ,  B29C45/48 ,  B29C65/48

CPC classification number: B29C65/50 ,  B29C66/13 ,  B29C66/742 ,  B32B7/12 ,  B32B17/10816 ,  B29C33/38 ,  B29C45/48 ,  B29C65/48

Abstract: A reinforcement structure includes an adherend, such as a metal plate, and a reinforcement sheet adhering thereto. The reinforcement sheet includes a front layer containing a plurality of fibers, a core material layer, and an adhesive layer. The reinforcement structure is capable of intensively reinforcing a first corner portion of the adherend and obtaining an improvement in strength.

公开(公告)号：US11476586B2

公开(公告)日：2022-10-18

申请号：US17264095

申请日：2020-06-05

Applicant: NITTO DENKO CORPORATION

Inventor： Takehiro Ui ,  Masatsugu Koso ,  Kazuhiro Fuke ,  Yuya Matsuzaki ,  Masataka Usui

IPC: B32B7/02 ,  H05K9/00 ,  H01Q17/00

Abstract: A radio wave absorbing member 1a includes a radio wave absorber 10 and a support 20 having a sheet shape. The radio wave absorber 10 includes a resistive layer 12, a reflective layer 14, and a dielectric layer 13. The reflective layer 14 reflects a radio wave. The dielectric layer 13 is disposed between the resistive layer 12 and the reflective layer 14 in the thickness direction of the reflective layer 14. The support 20 supports the radio wave absorber 10. The support 20 includes a matrix resin 20m and a flame retardant 20p.

公开(公告)号：US09082940B2

公开(公告)日：2015-07-14

申请号：US13914158

申请日：2013-06-10

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Ebe ,  Hiroyuki Katayama ,  Ryuichi Kimura ,  Hidenori Onishi ,  Kazuhiro Fuke

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/52 ,  H01L21/56 ,  H01L23/28 ,  H01L33/00

CPC classification number: H01L33/501 ,  H01L21/568 ,  H01L23/28 ,  H01L33/0095 ,  H01L33/52 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board; disposing a semiconductor element at one side in a thickness direction of the support sheet; disposing an encapsulating layer formed from an encapsulating resin composition containing a curable resin at the one side in the thickness direction of the support sheet so as to cover the semiconductor element; curing the encapsulating layer to encapsulate the semiconductor element by the encapsulating layer that is flexible; cutting the encapsulating layer that is flexible corresponding to the semiconductor element to produce an encapsulating layer-covered semiconductor element; and peeling the encapsulating layer-covered semiconductor element from the support sheet.

Abstract translation: 一种封装层覆盖的半导体元件的制造方法，其特征在于，包括硬支撑基板的支撑片的制作工序。 在支撑片的厚度方向的一侧设置半导体元件; 在所述支撑片的厚度方向的一侧设置由包含固化性树脂的封装树脂组合物形成的封装层，以覆盖所述半导体元件; 固化该封装层以通过柔性的封装层封装该半导体元件; 切割对应于半导体元件的柔性的封装层以产生封装层覆盖的半导体元件; 以及将所述封装层覆盖的半导体元件从所述支撑片剥离。