Invention Grant
- Patent Title: Heat stabilized moulding composition
- Patent Title (中): 热稳定成型组合物
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Application No.: US14294086Application Date: 2014-06-02
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Publication No.: US08975325B2Publication Date: 2015-03-10
- Inventor: Pieter Gijsman , Wilhelmus J. M. Sour , Rudy Rulkens , Robert H. C. Janssen
- Applicant: DSM IP Assets B.V.
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Priority: EP05075064 20050112
- Main IPC: C08K3/08
- IPC: C08K3/08 ; C08L77/00 ; B29C45/00 ; C08L77/02

Abstract:
Non-fibrous-reinforced thermoplastic molding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.
Public/Granted literature
- US20140288224A1 HEAT STABILIZED MOULDING COMPOSITION Public/Granted day:2014-09-25
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