Invention Grant
- Patent Title: Transmission line for electronic circuits
- Patent Title (中): 电子线路传输线
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Application No.: US13279138Application Date: 2011-10-21
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Publication No.: US08975737B2Publication Date: 2015-03-10
- Inventor: Pierre Bar , Sylvain Joblot , Jean-François Carpentier
- Applicant: Pierre Bar , Sylvain Joblot , Jean-François Carpentier
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics S.A.
- Current Assignee: STMicroelectronics S.A.
- Current Assignee Address: FR Montrouge
- Agency: Seed IP Law Group PLLC
- Priority: FR1058826 20101027
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01P3/08 ; H01L23/66 ; H01L25/065 ; H01P5/02 ; H01L27/00
Abstract:
A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane made of a conductive material formed in at least one metallization level of the second chip.
Public/Granted literature
- US20120106120A1 TRANSMISSION LINE FOR ELECTRONIC CIRCUITS Public/Granted day:2012-05-03
Information query
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