发明授权
- 专利标题： Wiring material and semiconductor module using the same
- 专利标题（中）： 接线材料和半导体模块使用相同
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申请号： US14238376申请日： 2012-08-13
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公开(公告)号： US08975747B2公开(公告)日： 2015-03-10
- 发明人: Takashi Ando , Ryoichi Kajiwara , Hiroshi Hozoji
- 申请人： Takashi Ando , Ryoichi Kajiwara , Hiroshi Hozoji
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Foley & Lardner LLP
- 优先权： JP2011-215898 20110930
- 国际申请： PCT/JP2012/070616 WO 20120813
- 国际公布： WO2013/046966 WO 20130404
- 主分类号： H01L23/14
- IPC分类号： H01L23/14 ; H01L23/48 ; H01L23/498 ; H01L21/60 ; H01L23/00 ; H01L23/373 ; H01L23/495
摘要：
There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.
公开/授权文献
- US20140191399A1 WIRING MATERIAL AND SEMICONDUCTOR MODULE USING THE SAME 公开/授权日：2014-07-10
信息查询
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