Invention Grant
- Patent Title: Pressure controlled heat pipe temperature control plate
- Patent Title (中): 压力控制热管温控板
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Application No.: US13653923Application Date: 2012-10-17
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Publication No.: US08975817B2Publication Date: 2015-03-10
- Inventor: Michael C. Kellogg , Rajinder Dhindsa , Tom Stevenson
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: H01J7/24
- IPC: H01J7/24 ; H01J37/32

Abstract:
A showerhead electrode assembly for a plasma processing chamber, which includes a showerhead electrode; a heater plate secured to the showerhead electrode; at least one pressure controlled heat pipe secured to an upper surface of the heater plate, the at least one pressure controlled heat pipe having a heat transfer liquid contained therein, and a pressurized gas, which produces a variable internal pressure within the at least one pressure controlled heat pipe; a top plate secured to an upper surface of the at least one heat pipe; and wherein the variable internal pressure within the at least one pressure controlled heat pipe during heating of the showerhead electrode by the heater plate displaces the heat transfer liquid from a thermal path between the top plate and the heater plate, and when removing excess heat from the showerhead electrode returns the heat transfer liquid to the thermal path.
Public/Granted literature
- US20140103806A1 PRESSURE CONTROLLED HEAT PIPE TEMPERATURE CONTROL PLATE Public/Granted day:2014-04-17
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