Invention Grant
- Patent Title: Adhesive applying device
- Patent Title (中): 粘合剂施加装置
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Application No.: US13564717Application Date: 2012-08-02
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Publication No.: US08978581B2Publication Date: 2015-03-17
- Inventor: Koji Yano
- Applicant: Koji Yano
- Applicant Address: JP Kitakyushu-Shi
- Assignee: Kabushiki Kaisha Yaskawa Denki
- Current Assignee: Kabushiki Kaisha Yaskawa Denki
- Current Assignee Address: JP Kitakyushu-Shi
- Agency: Mori & Ward, LLP
- Priority: JP2011-168983 20110802
- Main IPC: B05C11/10
- IPC: B05C11/10 ; B05B3/00 ; H02K15/03 ; B05C5/00 ; B05C5/02 ; B05C7/06 ; B05C9/12 ; B05B13/02 ; B25J9/16 ; B05C17/005 ; B05C17/015

Abstract:
An adhesive applying device includes a robot including a robot arm; a rotor set jig for setting thereat a rotor; a gun including a holder to which a cartridge containing the adhesive is mountable, the gun discharging the adhesive in the cartridge mounted to the holder and being mountable to an end of the robot arm; an electromagnetic valve that performs on/off switching control of supply of compressed air at a predetermined pressure into the cartridge mounted to the holder of the gun; a robot controller that controls an operation of the robot; and an upper-order controller that coordinates and controls the on/off switching control performed by the electromagnetic valve and the control of the operation of the robot performed by the robot controller.
Public/Granted literature
- US20130032090A1 ADHESIVE APPLYING DEVICE Public/Granted day:2013-02-07
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