发明授权
- 专利标题： Megasonic cleaning system
- 专利标题（中）： 超声波清洗系统
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申请号： US11836458申请日： 2007-08-09
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公开(公告)号： US08978673B2公开(公告)日： 2015-03-17
- 发明人: Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
- 申请人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
- 申请人地址： HK Hong Kong
- 专利权人： ASM Assembly Automation Ltd
- 当前专利权人： ASM Assembly Automation Ltd
- 当前专利权人地址： HK Hong Kong
- 代理机构： Ostrolenk Faber LLP
- 主分类号： B08B3/12
- IPC分类号： B08B3/12 ; B08B3/02 ; H01L21/67
摘要：
A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
公开/授权文献
- US20090038638A1 MEGASONIC CLEANING SYSTEM 公开/授权日：2009-02-12
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