Invention Grant
- Patent Title: Low-profile mezzanine connector
- Patent Title (中): 薄型夹层连接器
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Application No.: US13688392Application Date: 2012-11-29
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Publication No.: US08979551B2Publication Date: 2015-03-17
- Inventor: John Mongold , Randall Musser , Brian Vicich
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/73 ; H01R12/70 ; H01R12/71
Abstract:
A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.
Public/Granted literature
- US20140148022A1 LOW-PROFILE MEZZANINE CONNECTOR Public/Granted day:2014-05-29
Information query
