Invention Grant
US08980529B2 Radiation-sensitive resin composition, polymer, and resist pattern-forming method
有权
辐射敏感性树脂组合物,聚合物和抗蚀剂图案形成方法
- Patent Title: Radiation-sensitive resin composition, polymer, and resist pattern-forming method
- Patent Title (中): 辐射敏感性树脂组合物,聚合物和抗蚀剂图案形成方法
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Application No.: US13830880Application Date: 2013-03-14
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Publication No.: US08980529B2Publication Date: 2015-03-17
- Inventor: Yasuhiko Matsuda , Norihiko Sugie , Tomohiro Kakizawa , Takakazu Kimoto
- Applicant: JSR Corporation
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-208778 20100917
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F220/30 ; C08F224/00 ; G03F7/039 ; G03F7/20

Abstract:
A radiation-sensitive resin composition includes a polymer component, a radiation-sensitive acid generating agent, and a nitrogen-containing compound having a ring structure. The polymer component includes, in an identical polymer or different polymers, a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). R1 represents a hydrogen atom or a methyl group. Z is a group which represents a divalent monocyclic alicyclic hydrocarbon group taken together with R2. R2 represents a carbon atom. R3 represents a methyl group or an ethyl group. R4 represents a hydrogen atom or a methyl group. X is a group which represents a divalent bridged alicyclic hydrocarbon group having no less than 10 carbon atoms taken together with R5. R5 represents a carbon atom. R6 represents a branched alkyl group having 3 or 4 carbon atoms.
Public/Granted literature
- US20130203000A1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, AND RESIST PATTERN-FORMING METHOD Public/Granted day:2013-08-08
Information query
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