Invention Grant
- Patent Title: Cooktop heating element with improved connection structure
- Patent Title (中): 炉面加热元件具有改进的连接结构
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Application No.: US11930768Application Date: 2007-10-31
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Publication No.: US08981267B2Publication Date: 2015-03-17
- Inventor: Seung Jo Baek , Young Jun Lee , Hyoung Jun Kim , Byeong Wook Park
- Applicant: Seung Jo Baek , Young Jun Lee , Hyoung Jun Kim , Byeong Wook Park
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2007-0022840 20070308
- Main IPC: H05B3/02
- IPC: H05B3/02 ; H05B3/08 ; H05B3/00 ; H05B3/68

Abstract:
A heating device having an improved heat resistance structure is provided. The heating device may include a heating element that generates heat, and an elastic conductive part that applies electricity to the heating element. A connector may be provided between the elastic conductive part and the heating element to preclude direct contact between the heating element and the elastic conductive part. The heating element may be fixed to one side of the connector, and the elastic conductive part may be fixed to the other side of the connector to allow current applied from the elastic conductive part to flow to the heating element.
Public/Granted literature
- US20080217323A1 HEATING DEVICE Public/Granted day:2008-09-11
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