Invention Grant
US08981329B1 Method of forming anneal-resistant embedded resistor for non-volatile memory application
有权
用于非易失性存储器应用的形成耐退火嵌入式电阻器的方法
- Patent Title: Method of forming anneal-resistant embedded resistor for non-volatile memory application
- Patent Title (中): 用于非易失性存储器应用的形成耐退火嵌入式电阻器的方法
-
Application No.: US14548408Application Date: 2014-11-20
-
Publication No.: US08981329B1Publication Date: 2015-03-17
- Inventor: Mihir Tendulkar , David Chi
- Applicant: Intermolecular Inc. , Kabushiki Kaisha Toshiba , SanDisk 3D LLC
- Applicant Address: US CA San Jose JP Tokyo US CA Milpitas
- Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee Address: US CA San Jose JP Tokyo US CA Milpitas
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L45/00 ; H01L49/02 ; H01L27/24

Abstract:
Embodiments of the invention include a nonvolatile memory device that contains nonvolatile resistive random access memory device with improved device performance and lifetime. In some embodiments, nonvolatile resistive random access memory device includes a diode, a metal silicon nitride embedded resistor, and a resistive switching layer disposed between a first electrode layer and a second electrode layer. In some embodiments, the method of forming a resistive random access memory device includes forming a diode, forming a metal silicon nitride embedded resistor, forming a first electrode layer, forming a second electrode layer, and forming a resistive switching layer disposed between the first electrode layer and the second electrode layer.
Public/Granted literature
- US20150069319A1 Method of forming anneal-resistant embedded resistor for non-volatile memory application Public/Granted day:2015-03-12
Information query
IPC分类: