发明授权
US08981329B1 Method of forming anneal-resistant embedded resistor for non-volatile memory application
有权
用于非易失性存储器应用的形成耐退火嵌入式电阻器的方法
- 专利标题: Method of forming anneal-resistant embedded resistor for non-volatile memory application
- 专利标题(中): 用于非易失性存储器应用的形成耐退火嵌入式电阻器的方法
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申请号: US14548408申请日: 2014-11-20
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公开(公告)号: US08981329B1公开(公告)日: 2015-03-17
- 发明人: Mihir Tendulkar , David Chi
- 申请人: Intermolecular Inc. , Kabushiki Kaisha Toshiba , SanDisk 3D LLC
- 申请人地址: US CA San Jose JP Tokyo US CA Milpitas
- 专利权人: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- 当前专利权人: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- 当前专利权人地址: US CA San Jose JP Tokyo US CA Milpitas
- 主分类号: H01L29/02
- IPC分类号: H01L29/02 ; H01L45/00 ; H01L49/02 ; H01L27/24
摘要:
Embodiments of the invention include a nonvolatile memory device that contains nonvolatile resistive random access memory device with improved device performance and lifetime. In some embodiments, nonvolatile resistive random access memory device includes a diode, a metal silicon nitride embedded resistor, and a resistive switching layer disposed between a first electrode layer and a second electrode layer. In some embodiments, the method of forming a resistive random access memory device includes forming a diode, forming a metal silicon nitride embedded resistor, forming a first electrode layer, forming a second electrode layer, and forming a resistive switching layer disposed between the first electrode layer and the second electrode layer.
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