发明授权
- 专利标题： Light emitting diode package
- 专利标题（中）： 发光二极管封装
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申请号： US14336055申请日： 2014-07-21
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公开(公告)号： US08981415B1公开(公告)日： 2015-03-17
- 发明人: Che-Ming Hsu , Wen-Kai Shao , Liang-Ta Lin
- 申请人： Lextar Electronics Corporation
- 申请人地址： TW Hsinchu
- 专利权人： Lextar Electronics Corporation
- 当前专利权人： Lextar Electronics Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Moser Taboada
- 优先权： TW102135095A 20130927
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L33/50 ; H01L33/56
摘要：
A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.
公开/授权文献
- US20150091034A1 LIGHT EMITTING DIODE PACKAGE 公开/授权日：2015-04-02
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