Invention Grant
US08981418B2 LED device with structure for precisely locating LEDs thereon and method for manufacturing the same
有权
具有用于精确定位LED的结构的LED装置及其制造方法
- Patent Title: LED device with structure for precisely locating LEDs thereon and method for manufacturing the same
- Patent Title (中): 具有用于精确定位LED的结构的LED装置及其制造方法
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Application No.: US13572684Application Date: 2012-08-12
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Publication No.: US08981418B2Publication Date: 2015-03-17
- Inventor: Chih-Chen Lai
- Applicant: Chih-Chen Lai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H05K1/11 ; H05K3/30 ; H05K3/34
Abstract:
An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.
Public/Granted literature
- US20130214316A1 LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-08-22
Information query
IPC分类:
