Invention Grant
US08981492B2 Methods of forming an e-fuse for an integrated circuit product and the resulting integrated circuit product
有权
形成用于集成电路产品的电子熔丝的方法以及由此产生的集成电路产品
- Patent Title: Methods of forming an e-fuse for an integrated circuit product and the resulting integrated circuit product
- Patent Title (中): 形成用于集成电路产品的电子熔丝的方法以及由此产生的集成电路产品
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Application No.: US13928060Application Date: 2013-06-26
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Publication No.: US08981492B2Publication Date: 2015-03-17
- Inventor: O Sung Kwon , Xiaoqiang Zhang , Anurag Mittal
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/02 ; H01L21/306 ; H01L23/525 ; H01L21/768 ; H01L27/06
Abstract:
An integrated circuit product is disclosed that includes a resistor body and an e-fuse body positioned on a contact level dielectric material, wherein the resistor body and the e-fuse body are made of the same conductive material, a first plurality of conductive contact structures are coupled to the resistor body, conductive anode and cathode structures are conductively coupled to the e-fuse body, wherein the first plurality of conductive contact structures and the conductive anode and cathode structures are made of the same materials.
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