发明授权
- 专利标题: Charge pump capacitor assembly with silicon etching
- 专利标题(中): 带硅蚀刻的电荷泵电容器组件
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申请号: US14039033申请日: 2013-09-27
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公开(公告)号: US08981535B2公开(公告)日: 2015-03-17
- 发明人: John M. Muza
- 申请人: Robert Bosch GmbH
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 代理机构: Michael Best & Friedrich LLP
- 主分类号: H01L29/84
- IPC分类号: H01L29/84 ; H01L29/06 ; H01L49/02 ; H01L27/02 ; H01L27/08 ; H02M3/07
摘要:
Charge pump capacitor assemblies and methods of manufacturing the same. One charge pump capacitor assembly includes a charge pump capacitor and a silicon substrate. The charge pump capacitor includes: a silicon-based charge pump capacitor oxide layer, a first terminal on a first side of the silicon-based charge pump layer, a second terminal on a second side of the silicon-based charge pump capacitor oxide layer opposite the first side, and a field oxide layer mounted adjacent the second terminal. The charge pump capacitor is coupled to the silicon substrate. The silicon substrate is etched to reduce contact between the silicon substrate and the field oxide layer.
公开/授权文献
- US20140319658A1 CHARGE PUMP CAPACITOR ASSEMBLY WITH SILICON ETCHING 公开/授权日:2014-10-30
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