Invention Grant
- Patent Title: Multi chip package
- Patent Title (中): 多芯片封装
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Application No.: US13340436Application Date: 2011-12-29
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Publication No.: US08981549B2Publication Date: 2015-03-17
- Inventor: Hye Jin Kim , Going Sik Kim , Chang Sup Ryu
- Applicant: Hye Jin Kim , Going Sik Kim , Chang Sup Ryu
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Bracewell & Giuliani LLP
- Agent Brad Y. Chin
- Priority: KR10-2010-0139897 20101231
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/498 ; H01L25/065 ; H01L23/13 ; H01L23/31
Abstract:
The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.
Public/Granted literature
- US20120168960A1 MULTI CHIP PACKAGE Public/Granted day:2012-07-05
Information query
IPC分类:
