发明授权
US08981559B2 Package on package devices and methods of packaging semiconductor dies
有权
封装器件封装以及封装半导体管芯的方法
- 专利标题： Package on package devices and methods of packaging semiconductor dies
- 专利标题（中）： 封装器件封装以及封装半导体管芯的方法
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申请号： US13532402申请日： 2012-06-25
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公开(公告)号： US08981559B2公开(公告)日： 2015-03-17
- 发明人: Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- 申请人： Chun-Lei Hsu , Chung-Shi Liu , De-Yuan Lu , Ming-Che Ho , Yu-Feng Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/48 ; H01L23/31 ; H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/00
摘要：
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.
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