Invention Grant
US08981573B2 Apparatus, system, and method for wireless connection in integrated circuit packages
有权
用于集成电路封装中的无线连接的装置，系统和方法
- Patent Title: Apparatus, system, and method for wireless connection in integrated circuit packages
- Patent Title (中): 用于集成电路封装中的无线连接的装置，系统和方法
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Application No.: US13970241Application Date: 2013-08-19
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Publication No.: US08981573B2Publication Date: 2015-03-17
- Inventor: Jiamiao Tang , Henry Xu , Shinichi Sakamoto
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L23/00 ; H01L25/065
Abstract:
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Public/Granted literature
- US20140042639A1 APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES Public/Granted day:2014-02-13
Information query
IPC分类:
