Invention Grant
- Patent Title: Sensor array package
- Patent Title (中): 传感器阵列包
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Application No.: US13842092Application Date: 2013-03-15
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Publication No.: US08981578B2Publication Date: 2015-03-17
- Inventor: Matthew E. Last , Lili Huang , Seung Jae Hong , Ralph E. Kauffman , Tongbi Tom Jiang
- Applicant: Apple Inc.
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.
Public/Granted literature
- US20130285240A1 SENSOR ARRAY PACKAGE Public/Granted day:2013-10-31
Information query
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