公开(公告)号：US08981578B2

公开(公告)日：2015-03-17

申请号：US13842092

申请日：2013-03-15

Applicant: Apple Inc.

Inventor： Matthew E. Last ,  Lili Huang ,  Seung Jae Hong ,  Ralph E. Kauffman ,  Tongbi Tom Jiang

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L21/485 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.

Abstract translation: 传感器阵列封装可以包括设置在基板的第一侧上的传感器。 信号沟槽可以沿着衬底的边缘形成，并且导电层可以沉积在信号沟槽中并且可以耦合到传感器信号焊盘。 接合线可以附接到导电层并且可以被布置成在传感器的表面下方。 传感器阵列封装可嵌入印刷电路板中，使得接合线能够终止于印刷电路板内的其它导体。

公开(公告)号：US20200107436A1

公开(公告)日：2020-04-02

申请号：US16375503

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H05K1/02 ,  H01L33/24 ,  H01L25/16 ,  H01L23/31 ,  H01L33/08 ,  H01L33/62

Abstract: A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.

公开(公告)号：US10993317B2

公开(公告)日：2021-04-27

申请号：US16375493

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H05K1/02 ,  H01L33/24 ,  H01L33/62 ,  H01L33/08 ,  H01L25/16 ,  H01L23/31 ,  H05K5/06

Abstract: An optical module may be formed on a wafer. The wafer may include a substrate and one or more optical components encapsulated, at least partially, by the substrate. Each of the optical components are configured to emit or sense light. The wafer may also include one or more printed circuit board (PCB) bars encapsulated, at least partially, by the substrate allowing electrical conductivity from a first side of the substrate to a second side of the substrate. The wafer may also include at least one redistribution layer to electrically couple at least one of the optical components to at least one of the PCB bars.

公开(公告)号：US10811400B2

公开(公告)日：2020-10-20

申请号：US16375503

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H01L31/12 ,  H01L25/16 ,  H01L33/24 ,  H01L33/62 ,  H01L23/31 ,  H01L33/08 ,  H01L31/18 ,  H01L33/00 ,  H01L27/15

Abstract: A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.