Invention Grant
- Patent Title: Multi-valued on-die termination
- Patent Title (中): 多值片上终端
-
Application No.: US13952393Application Date: 2013-07-26
-
Publication No.: US08981811B2Publication Date: 2015-03-17
- Inventor: Kyung Suk Oh , Ian P. Shaeffer
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Charles Shemwell
- Main IPC: H03K17/16
- IPC: H03K17/16 ; H03K19/0175 ; G06F13/40 ; G11C11/4093

Abstract:
An integrated circuit memory device stores a plurality of digital values that specify respective termination impedances. The memory device switchably couples respective sets of load elements to a data input/output (I/O) to apply the termination impedances specified by the digital values, including, applying a first termination impedance to the data I/O during an idle state of the memory device, applying a first one of two non-equal termination impedances to the data I/O while the memory device receives write data in a memory write operation and applying a second one of the two non-equal termination impedances to the data I/O while another memory device receives write data in a memory write operation. When outputting read data via the data I/O in a memory read operation, the memory device switchably couples to the data I/O at least a portion of the load elements included in the sets of load elements.
Public/Granted literature
- US20130307584A1 MULTI-VALUED ON-DIE TERMINATION Public/Granted day:2013-11-21
Information query