Invention Grant
- Patent Title: Filtered feedthrough assembly and associated method
- Patent Title (中): 过滤馈通装配及相关方法
-
Application No.: US13765539Application Date: 2013-02-12
-
Publication No.: US08982532B2Publication Date: 2015-03-17
- Inventor: Rajesh V. Iyer
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: H01G4/35
- IPC: H01G4/35 ; A61N1/375 ; H01G4/236

Abstract:
A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.
Public/Granted literature
- US20130215553A1 FILTERED FEEDTHROUGH ASSEMBLY AND ASSOCIATED METHOD Public/Granted day:2013-08-22
Information query