Invention Grant
US08986486B2 Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
有权
用于半导体器件生产的膜，用于制造用于半导体器件生产的膜的方法和用于半导体器件生产的方法
- Patent Title: Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
- Patent Title (中): 用于半导体器件生产的膜，用于制造用于半导体器件生产的膜的方法和用于半导体器件生产的方法
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Application No.: US13170581Application Date: 2011-06-28
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Publication No.: US08986486B2Publication Date: 2015-03-24
- Inventor: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-169556 20100728
- Main IPC: B32B38/04
- IPC: B32B38/04 ; C09J7/02 ; H01L21/56 ; H01L21/683 ; H01L23/29 ; H01L23/31 ; H01L23/00 ; H01L23/544
Abstract:
The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.
Public/Granted literature
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