发明授权
- 专利标题： Electronic device and process for manufacturing electronic device
- 专利标题（中）： 电子设备和电子设备制造工艺
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申请号： US13549021申请日： 2012-07-13
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公开(公告)号： US08986588B2公开(公告)日： 2015-03-24
- 发明人: Kenji Uchida , Koki Hirasawa
- 申请人： Kenji Uchida , Koki Hirasawa
- 申请人地址： JP Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2008-309276 20081204
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; H01L31/0203 ; H01L27/146 ; H01L23/00
摘要：
The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
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