发明授权
US08987064B2 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
有权
具有模制网格阵列机构的集成电路封装系统及其制造方法
- 专利标题： Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof
- 专利标题（中）： 具有模制网格阵列机构的集成电路封装系统及其制造方法
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申请号： US13740151申请日： 2013-01-11
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公开(公告)号： US08987064B2公开(公告)日： 2015-03-24
- 发明人: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人： Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/48 ; H01L21/56 ; H01L23/495 ; H01L21/48
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an insulation cover on the lead-frame and on the metal connector; connecting an integrated circuit die over the insulation cover; forming a top encapsulation on the integrated circuit die with the peripheral mounting region exposed from the top encapsulation; forming a routing layer, having a conductive land, from the lead-frame; and forming a bottom encapsulation partially encapsulating the routing layer and the insulation cover.
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