发明授权
- 专利标题： High aspect ratio stacked MLCC design
- 专利标题（中）： 高纵横比堆叠MLCC设计
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申请号： US13323916申请日： 2011-12-13
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公开(公告)号： US08988857B2公开(公告)日： 2015-03-24
- 发明人: John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey Bell
- 申请人： John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey Bell
- 申请人地址： US SC Simpsonville
- 专利权人： Kemet Electronics Corporation
- 当前专利权人： Kemet Electronics Corporation
- 当前专利权人地址： US SC Simpsonville
- 代理机构： Perkins Law Firm, LLC
- 代理商 Joseph T. Guy
- 主分类号： H01G2/20
- IPC分类号： H01G2/20 ; H01G4/06 ; H01G4/228 ; H01G4/30 ; H05K3/30 ; H01G4/38 ; H01G2/06 ; H01G4/232
摘要：
An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
公开/授权文献
- US20130146347A1 HIGH ASPECT RATIO STACKED MLCC DESIGN 公开/授权日：2013-06-13
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