Invention Grant
- Patent Title: Modular jack with enhanced port isolation
- Patent Title (中): 具有增强的端口隔离的模块化插孔
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Application No.: US13508467Application Date: 2010-11-04
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Publication No.: US08992248B2Publication Date: 2015-03-31
- Inventor: Brian P. O'Malley , Michael R. Kamarauskas , Timothy R. McClelland , Emanuel G. Banakis , Johnny Chen , Kent E. Regnier
- Applicant: Brian P. O'Malley , Michael R. Kamarauskas , Timothy R. McClelland , Emanuel G. Banakis , Johnny Chen , Kent E. Regnier
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- International Application: PCT/US2010/055446 WO 20101104
- International Announcement: WO2011/056973 WO 20110512
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R13/6469 ; H01R107/00

Abstract:
An electrical connector includes a dielectric housing with a plurality of filtering modules therein. Each filtering module has a housing and a magnetics assembly including transformer cores with wires wrapped therearound. An array of pins extend from the module housing for connection to the wires. A plurality of tails extend from the module housing for interconnection to a circuit board upon which the connector may be mounted. An interconnection is provided between the pins and tails that may include filtering or other signal modifying circuitry.
Public/Granted literature
- US20130102203A1 MODULAR JACK WITH ENHANCED PORT ISOLATION Public/Granted day:2013-04-25
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